Timtronics® Thermal Epoxies & Potting Compounds

Timtronics thermally conductive epoxies and potting compounds are designed for bonding and encapsulation heat sensitive devices for the purpose of heat dispersion. Rapid heat transfer that can significantly reduce “hotspot” and dissipate the build-up temperature to ambient in a matters of seconds. These ranges of epoxies and adhesives are well adopted by electronics designers to be included in the manufacturing of microprocessors, heat sink, SMD devices, Lid Seal and many more.

  • Thermally Conductive Epoxies/Adhensives - TIM-800

    TIM-800 series are thermally conductive, electrically insulating epoxies engineered with highly conductive ceramic fillers and non silicone resins. They are designed for the demanding needs of die-attach heat sink bonding and surface mount applications. Rapid heat transfer properties eliminate hot spots and the low epoxy shrinkage factor minimizes the risk of damage to fragile components, resulting in increased operating efficiencies. Available in one part, two parts, heat curable and room temperature cure systems.





    Typical Applications :

    Fabricating heat sink, bonding semiconductors, substrate attach, lid seal, SMD attach, stacking components and die attach applications.

    Most Popular Products :

    • TIM-813: One part heat cure system, excellent conductivity and bond strength at high temperature
    • TIM-818: High strength, thermally conductive adhesive, flash cure in 5 minutes. No mix, two part system to replace mechanical clips, fasteners or tapes in securing heat generating devices and heat sink.
    Property 813 813HTC 816 816HTC 818
    Thermal Conductivity W/mºK 1.5 2.7 0.85 2.7 0.8
    Type/Cure One PartHeat Cure One PartHeat Cure Two PartRT Cure Two PartRT Cure Two PartNo MixFlash cure
    Pot life(100grams) ½ hr @ 80°C ½ hr @ 80°C ½ hr @ 25°C ½ hr @ 25°C 5 minutes@ 25°C
    Shelf life 4 months@25ºC 4 months@25ºC 2 years@25ºC 2 years@25ºC 1 years@25ºC
    Dielectric strength, V/Mil 460 460 420 420 570
    Max. Service Temperature ºC 270 270 150 150 150
  • Thermally Conductive Potting Compounds (TIM-PC-Series)

    TIM-PC series are pourable, filled epoxy resin systems offering excellent heat transfer, high voltage insulation, low exotherm and minimum shrinkage. These compounds transfer heat rapidly, thereby eliminating hot spots and increasing the operating efficiency of most encapsulated devices. The low shrinkage design feature minimizes risk of damage to fragile components.





    Typical Applications :

    These products are designed for protecting components in applications such as densely packaged power supplies and heat generating components, integrated circuits, power and operational amplifiers, transformers and many types of semiconductors.

    Property 8550TC 8006M-4 8207M-1 8850FT
    Type Silicone Epoxy Resin Epoxy Resin Epoxy Resin
    Thermal Conductivity W/mºK 1.2 0.63 0.60 1.3
    Type/Cure Two Part-RT Cure Two Part-RT Cure Two Part-RT Cure Two Part-RT Cure
    Mix Ratio 100:100 100:12 100:100 Depends on Hardener
    Pot life(100grams) ½ hr @ 25°C 2 hr @ 25°C 1-2 hr @ 25°C ½ hr @ 25°C
    Cure Schedule 24-48 hrs @ 25°C 24-48 hrs @ 25°C 24-48 hrs @ 25°C 24-48 hrs @ 25°C
    Shelf life 1 Year @25ºC 1 Year @25ºC 1 Year @25ºC 1 Year @25ºC
    Dielectric strength, V/Mil 460 480 415 460
    Max. Service Temperature ºC 140 120 110 140