Timtronics thermally conductive epoxies and potting compounds are designed for bonding and encapsulation heat sensitive devices for the purpose of heat dispersion. Rapid heat transfer that can significantly reduce “hotspot” and dissipate the build-up temperature to ambient in a matters of seconds. These ranges of epoxies and adhesives are well adopted by electronics designers to be included in the manufacturing of microprocessors, heat sink, SMD devices, Lid Seal and many more.
TIM-800 series are thermally conductive, electrically insulating epoxies engineered with highly conductive ceramic fillers and non silicone resins. They are designed for the demanding needs of die-attach heat sink bonding and surface mount applications. Rapid heat transfer properties eliminate hot spots and the low epoxy shrinkage factor minimizes the risk of damage to fragile components, resulting in increased operating efficiencies. Available in one part, two parts, heat curable and room temperature cure systems.
Fabricating heat sink, bonding semiconductors, substrate attach, lid seal, SMD attach, stacking components and die attach applications.
|Thermal Conductivity W/mºK||1.5||2.7||0.85||2.7||0.8|
|Type/Cure||One PartHeat Cure||One PartHeat Cure||Two PartRT Cure||Two PartRT Cure||Two PartNo MixFlash cure|
|Pot life(100grams)||½ hr @ 80°C||½ hr @ 80°C||½ hr @ 25°C||½ hr @ 25°C||5 minutes@ 25°C|
|Shelf life||4 months@25ºC||4 months@25ºC||2 years@25ºC||2 years@25ºC||1 years@25ºC|
|Dielectric strength, V/Mil||460||460||420||420||570|
|Max. Service Temperature ºC||270||270||150||150||150|
TIM-PC series are pourable, filled epoxy resin systems offering excellent heat transfer, high voltage insulation, low exotherm and minimum shrinkage. These compounds transfer heat rapidly, thereby eliminating hot spots and increasing the operating efficiency of most encapsulated devices. The low shrinkage design feature minimizes risk of damage to fragile components.
These products are designed for protecting components in applications such as densely packaged power supplies and heat generating components, integrated circuits, power and operational amplifiers, transformers and many types of semiconductors.
|Type||Silicone||Epoxy Resin||Epoxy Resin||Epoxy Resin|
|Thermal Conductivity W/mºK||1.2||0.63||0.60||1.3|
|Type/Cure||Two Part-RT Cure||Two Part-RT Cure||Two Part-RT Cure||Two Part-RT Cure|
|Mix Ratio||100:100||100:12||100:100||Depends on Hardener|
|Pot life(100grams)||½ hr @ 25°C||2 hr @ 25°C||1-2 hr @ 25°C||½ hr @ 25°C|
|Cure Schedule||24-48 hrs @ 25°C||24-48 hrs @ 25°C||24-48 hrs @ 25°C||24-48 hrs @ 25°C|
|Shelf life||1 Year @25ºC||1 Year @25ºC||1 Year @25ºC||1 Year @25ºC|
|Dielectric strength, V/Mil||460||480||415||460|
|Max. Service Temperature ºC||140||120||110||140|
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