Vitrobond
Vitrochem Technology has been in the forefront of developing a wide variety of high quality electronic grade epoxy resins targeting specifically at the electronic & electrical manufacturing and assembling companies.
We have over the years researched and co-developed with our customers a wide spectrum of adhesives that are being adopted by the manufacturing industries for the purpose of structural bonding, sealing, encapsulation and coating applications.
Our epoxy resins have been consistently being selected by the design and manufacturing engineers as their preferred materials due to our ability to custom build products that suit specifically to their stringent requirements.
Our products range includes:
One Part Heat Cure Epoxy
- COB or Glob Top Encapsulation
- Sealing
- Potting
- Chips Mounting
- Underfill
Two Part Epoxy Resin
- Potting
- Bonding
- Encapsulation
Two Part Potting Silicone Compound
- Potting
- Mold Making
- Casting
One Part Electrically Conductive Epoxy
- Die Attach
Two Part Electrically Conductive Epoxy
- Die Attach
- Circuit Board Repair
Thermally Conductive Epoxy
- Heat Sink Attachment
- Heat Dissipation from Power Device