Vitrobond® Two Part Epoxy

Vitrochem Technology produces a wide range of electronic grade 2 part epoxy mainly for potting, encapsulation and casting purposes under the brand name Vitrobond. These epoxies can be formulated to have a wide range of mechanical, thermal, optical clarity, mix ratios, thermal conductivity and dielectric properties. To meet the industry standard requirement, most of our epoxy systems comply with ROHS & REACH directive. The typical applications would be potting of RFID tags, LED lamp housing, telecommunication modules and electronic components that need to be insulated from harsh environment, dielectric properties and for security reason.

  • Two Part Epoxy

    Product Description/Application Application Mix Ratio By Weight Viscosity,cps Pot Life (25°C)
    Vitrobond EPH 203
    • Good Optical Clarity
    • Excellent Impact Resistance
    • Good Chemical Resistance
    • LED Potting
    • Doming
    • RFID Tags Potting
    100:50 Part A: 10’000
    Part B: 3’000
    30 Minutes
    Vitrobond EPH 215
    • Filled System
    • Good Impact & Heat Resistance
    • Low Exothermic
    • High power voltage potting
    • Heat exchanger potting
    100:20 Part A: 30’000
    Part B: 500
    2 Hours
    Vitrobond EPH 220C
    • Ultra Clear
    • Non Yellowing
    • Excellent Chemical & Weather Resistance
    • LED Casting & Potting
    • Prototyping
    • Coil Potting
    100:40 Part A: 2’000
    Part B: 800
    50 Minutes
    Vitrobond EPH 242C
    • Clear and Slightly Flexible
    • Low Shrinkage
    • Excellent Weather Resistance
    • For Doming and Casting
    • Potting of electronics parts
    100:50 Part A: 600
    Part B: 100
    2 Hours
    Vitrobond EPH 360
    • Clear & Hard
    • Good Dielectric Strength
    • Excellent Thermal Shock Resistance
    • Bonds Well to Metals & Plastic
    • Good Surface Finishing
    • Potting and Encapsulation of DC Motors
    • Potting of sensors and connectors
    100:50 Part A: 1500
    Part B: 500
    45 Minutes
    Vitrobond EPH 365
    • Self Leveling
    • Glossy Black Surface
    • Good Dielectric
    • Excellent Thermal Shock Resistance
    • Encapsulation of RIFD tags & devices
    • Potting heater elements
    • Potting of telecom devices
    100:50 Part A: 13’000
    Part B: 800
    180 Minutes
    Vitrobond EPH 370
    • Clear Medium Viscosity
    • Good Thermal & Electrical Resistance
    • Good Impact Resistance
    • For RFID tags potting
    • Encapsulation of electronic devices
    100:50 Part A: 17’000
    Part B: 7’000
    25 Minutes
    Vitrobond EPH 367
    • Flexible System
    • Low Viscosity
    • Good Chemical & Thermal Resistance
    • Good Impact & Shock Resistance
    • For potting and Sealing
    • Potting of sensitive components
    • Potting of sensors and transducers
    100:50 Part A: 25’000
    Part B: 200
    45 Minutes
    Vitrobond EPH 601
    • Fast cure
    • Low Viscosity
    • High Heat Resistance
    • Color Change Formulation
    • High Glass Transition Temperature
    • Good Electrical Properties
    • Sealing of spindle motors
    • Potting of high temperature sensors
    • Potting of relays and RFID tags
    100:10 4000 – Mixed Viscosity 2 Hours
    Vitrobond EPH 2050
    • Low Thermal Expansion
    • Good Thermal Conductivity
    • Excellent Chemical & Electrical Reistance
    • Excellent Thermal Shock
    • Meets UL fire rating
    • Potting of sensitive components
    • Potting of sensors and transducers
    100:20 Part A: 35’000
    Part B: 200
    50 Minutes
    Vitrobond EPH 2150 TC
    • Good Thermal Conductivity
    • Excellent Chemical and Temperature Resistance
    • Potting of heat sink components
    • Encapsulation of transformers
    100:20 Part A: 30’000
    Part B: 200
    50 Minutes
    Vitrobond EPH 4070
    • Excellent Thermal Resistance
    • Heat Curable
    • Good Thermal Conductivity
    • High TG
    • Designed to pass UL 94 VO
    • Potting of ignition coil
    • Potting of transformer and sensors
    100:100 Part A: 50’000
    Part B: 35’000
    12 Hours