Vitrobond® One Part Epoxy

Vitrochem Technology has developed and produced a good range of 1 Part heat curable epoxy compound mainly used in the electronic industry for Glob Top encapsulation or Chip-On-Board, Die Attach, Chips Bonding and Ferrite Bonding applications. These epoxies have been designed to meet the industry standard requirements in term of mechanical, electrical, thermal and reliability performances. Our ability to custom build new epoxy formulation and fast turnaround time has positioned our company to be the preferred partner by most of the electronic OEMs in this region.

  • Encapsulation, Bonding & Underfill

    Product Description Application Viscosity, cps Cure Profile
    Vitrobond EC 108
    • Thixotropic & high viscosity
    • Low after cure shrinkage
    • High TG
    • Excellent pot life
    Glob Top 150’000 130°C @ 1 Hour
    Vitrobond EN 480
    • Thick paste
    • Excellent thermal resistance
    • Good TG
    • Long pot life
    • Dam purpose
    • Sealing of relay
    191’000 120°C @ 1 Hour
    Vitrobond EN 484
    • Black paste
    • Good dielectric properties
    • Bonds well to most metals & plastics
    • High TG
    • Bonding of electronic components
    • Sealing of VCM coils
    • Ferrite Bonding
    Paste 130°C @ 2 Hours
    VitrobondEN 640-T5
    • High viscosity
    • Excellent thermal shock resistance
    • Low ionic contents
    • Long pot life
    Glob Top 72’000 130°C @ 2 Hours
    Vitrobond EC 401
    • Excellent bonding to most metals, including
      ceramic
    • Long pot life
    • Good thermal and chemical resistance
    • Ferrite magnet bonding
    • Ceramic components bonding
    15’000Thixotropic 140°C @ 40 Minutes
    Vitrobond EC 465
    • Low viscosity
    • Good moisture & chemical resistance
    • Excellent heat transfer
    • Potting of sensors and transducers
    • Sealing of heat sensitive components
    30’000 110°C @ 2 Hours
    Vitrobond EB 1021
    • Highly thixotropic
    • Excellent heat resistance
    • Excellent chemical resistance
    • Long pot life
    • Low cost
    • Bonding abrasive paper to fiberglass disc
    • Bonding ferrite magnets
    Paste 130°C @ 2 Hours
    Vitrobond FCU 5631 Fast flow underfillFast cureHigh TG Under Fill Epoxy Encapsulant 12’000 160°C @ 7 MInutes
  • SMD Epoxy

    Product Description Application Viscosity, cps Cure Profile
    Vitrobond 7276
    • High green strength
    • Thixotropic
    • Suitable for dotting
    • Fast Cure
    • Suitable for most SMDs
    SMD Chips Bonder Paste 150°C @ 90 Seconds
    Vitrobond SMT 7607
    • High speed dotting
    • Good thermal and solder reflow resistance
    • Low Halogen
    • Good die shear
    SMD Chips Bonder Paste 150°C @ 90 Seconds
    Vitrobond SMT 7608
    • Good green strength
    • High dot profile
    • Stencil printing type
    • High die shear
    SMD Chips Bonder Paste 150°C @ 90 Seconds
    Vitrobond SMT 7610
    • Medium speed dotting
    • Good thermal and reflow resistance
    SMD Chips Bonder Paste 150°C @ 90 Seconds
    Vitrobond SMT 7619
    • High green strength
    • High dot profile
    • Stencil printing type
    • Good die shear
    SMD Chips Bonder Paste 150°C @ 90 Seconds
  • Electrically Conductive Epoxy

    Product Description Application Viscosity, cps Cure Profile
    Vitrobond AG 806-2
    • 1 Part heat cure
    • Low stress
    • Snap cure
    • No bleeding
    Die Attach Epoxy Circuitry rework 40’000 150°C @ 3-5 Minutes
    Vitrobond AG 8201
    • 2 Part room temperature cure
    • Low resistivity
    • Good bonding strength
    • Easy handling
    Circuitry rework Part A: PastePart B: 5’000 25°C @ 24 Hours