Timtronics® Gap Fillers & Pad

Timtronics Gap Fillers and Pads are designed to meet the stringent electronics industry’s ever growing requirement for interface materials for conformability, good thermal management and ease of use. The range of gap fillers and pads have characteristics like, removal air gaps to reduce thermal resistance, high conformability, vibration dampening and easy to apply.

  • TIM-GAP Thermally Conductive Gap Fillers

    Product Description:

    TIM-GAP is designed to meet industry’s growing need for interface material with high conductivity and greater conformability for easier application. Electrically isolating property allows its use in applications requiring isolations between heat sinks and high voltage, bare leaded devices. Available in Silicone and Non Silicone formulas with thermal conductivity up to 11 W/mºK.

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    Typical Application :

    Gap Fillers are used to fill air gaps between components or PC boards and heat sinks, metal enclosures and chasses. Ideal for application where large gap tolerances are present due to steps, rough surfaces, and high stack-up. Gap Filler materials allow the designer to be less concerned with components proximity to heat sinks or heat spreaders.

    Most Popular Products :

    • TIM-GAP 1102: Cost-effective, maximize heat transfer from electronic components to heat sink or heat spreaders. High thermal conductivity (2.4 W/mºK) with low modulus.
    • TIM-GAP 1106: Highly conformable, thermally conductive with electrically insulated. Commonly used in uneven, irregular surfaces to fill air gaps. High thermal conductivity (6W/mºK) with low modulus.
    • TIM-GAP ULTRA SOFT: Specially designed for extremely low stress applications, clean, production friendly, lowest modulus type, viscoelastic thermal interface material.
    • TIM-GAP NS: Non-Silicone gap filler specially formulated to replace silicone materials due to the silicone oil extraction and contamination. Suitable for aerospace and military applications.
    Physical Property TestMethod 1101 1102 1103 1106 1106 SOFT ULTRASOFT NS
    Type Silicone Silicone Silicone Silicone Silicone Silicone Silicone Non-Silicone
    Thermal ConductivityW/m °k ASTM D5470 Modified 1.4 2.4 2.8 6.0 11.0 1.3 1.5 1.6
    Thermal Resistance°Cin2/W (Thickness) TO-3 method 2.10(0.1″) 1.7(0.1″) 1.1(0.08″) 0.31(0.04″) 0.22(0.06″) 0.90(0.08″) 0.90(0.08″) 0.72(0.02″)
    Thermal Resistance°Cin2/W (Thickness) ASTM D257 1014 1014 1012 1012 1011 1010 1013 1015
    Volume Resistivity ASTM D2240 48 48 54 54 N/A 48 <5 53
    Elongation % 100 100 65 53 N/A 250 320
    Max Service Temperature  °C ASTM D412 200 200 200 200 200 200 200 110
    Available thickness, mm 0.5 to 5.0 0.5 to 5.0 0.5 to 5.0 0.5 to 5.0 0.5 to 5.0 1.5, 2.0, 2.5 0.5to3.0 2 to 5 0.5,1.0,2.0
  • TIM-PAD - Thermally Conductive Pads

    Product Description:

    TIM-PAD is a family of thermally conductive and electrically insulating silicone pads. They are clean, production friendly and efficient alternative to mica, ceramics or grease and will provide superb protection against damage due to deformation, shock or vibration. Available with or without adhesive for easy handling and installation.

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    Typical Application :

    Interface between a power transistor, CPU or other heat-generating components. Isolate electrical components and power sources from heat sink and/or mounting brackets. Interface for discrete semiconductors requiring low pressure spring clip mounting. Medical devices, military and industrial controls.

    Most Popular Products :

    • TIM-PAD 1001: Cost-effective, maximize heat transfer from electronic components to heat sink or heat spreaders. Excellent mechanical and physical characteristics with efficient heat dissipation. Flame retardant with excellent cut-through resistance and resistance to damage from cleaning agents.
    • TIM-PAD 1003: Offers high thermal conductivity (3W/m°k) and high dielectric properties.
    • TIM-GEL PAD: Very soft, highly conformable pad provides superb protection against damage due to deformation as well as shock or vibration. Gel like modulus provides stress absorbing flexibility.
    Physical Property TestMethod 1001 1002 1003 GEL-PAD
    Type Silicone Silicone Silicone Silicone
    Thermal ConductivityW/m °k ASTM D5470 Modified 1.1 1.6 3.0 1.6
    Thermal Resistance°Cin2/W (Thickness) TO-3 method 0.51 (0.08”) 0.55(0.08”) 0.3(0.08”) 0.35(0.01”)
    Volume Resistivity ASTM D257 1015 1015 1015 1015
    Hardness Shore 00 ASTM D2240 86 93 84 49
    Elongation % ASTM D412 <2 <2 <3 N/A
    Max.Service Temperature  °C 200 200 200 150
    Available thickness, mm 0.15,0.20,0.30 0.15,0.20,0.30 0.20,0.30 0.45,0.85 0.20,0.30 0.45,0.85 0.25
  • TIM-LGF Dispensable Liquid Gap Fillers

    Product Description:

    TIM-LGF are thermally conductive liquid gap filler materials formulated to provide a balance of cured material properties, highlighted by “gel-like” modules and good compression set or memory. This material is available in thermally conductive & electrically insulating or conductive, one part or two part, room or elevated temperature curing system. Form-in-place gap fillers are ideal for applying any thickness with little or no stress.

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    Typical Appllication:

    LED bonding, PCBA to housing, discrete component to heat spreader, Computer and Peripherals and Automotive Electronics.

    Most Popular Products:

    • TIM-LGF 2000: One part, heat cure silicone liquid gap filler ideal for coupling hot PC board components to heat sink. It forms soft elastomer in 15 minutes when expose to heat.
    • TIM-LGF 2004: Two part, room temperature cure, simple 1:1 mix ratio for easy application. Forms soft elastomer in 5 minutes when expose to heat. Very efficient heat dissipater.
    Property 2000 2001 2002 Electrically
    Conductive
    2004
    Viscosity cps 150,000 600,000 500,000 150,000
    Mix Ratio One PartHeat Cure One Part RTV One Part RTV Two Part 1:1
    Thermal Conductivity, W/ m °K 2.0 0.63 N/A 2.0
    Volume Resistivity, Ohm-cm 1012 1015 0.09 1012
    Cure time @ 25°C N/A 72 Hrs. 24 Hrs. 2 Hrs
    Cure time @ 120°C 30 Minutes N/A N/A 5 Minutes
    Pot Life @ 25°C 24 Hrs 8 Minutes 15 Minutes 1 Hr.
    Hardness, shore 00/(A) 70 40(A) 40(A) 70
  • Putty Materials

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    Product Description:

    TIM-PUTTY is ‘Ultra Soft” and highly conformable paste- type gap filler. Its “ultra soft” consistency assures efficient heat transfer between delicate parts where minimum pressure can be tolerated. This Form-in-place gap filler is ideal for applying any thickness with little or no stress. It is designed to provide a thermal solution for the recent trends of integrating higher frequency electronics into smaller devices. TIM-PUTTY easily forms and adheres to most surfaces, shapes and sizes of components with very low compression force. Non-Silicone formulas avoid silicone contaminations to delicate devices. It can be easily dispensed from cartridges or pail using pneumatic dispenser.

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    Typical Application :

    TIM-PUTTY is used to fill air gaps between components or PC boards and heat sinks, metal enclosures and chasses. Ideal for application where large gap tolerances are present due to steps, rough surfaces, and high stack-up. TIM-Putty materials allow the designer to be less concerned of CTE stresses during thermal cycling.

    Most Popular Products :

    • TIM-PUTTY 418: Non-Silicone, cost-effective, maximize heat transfer from electronic components to heat sink or heat spreaders. High thermal conductivity (2.1W/mºK) with low modulus
    • TIM-PUTTY 418HTC: Non-Silicone, highly conformable, thermally conductive and electrically Insulating. Commonly used in uneven, irregular surfaces to fills air gaps. High thermal conductivity (3.2W/mºK) with low modulus.

    Availability : Tim-Putty are generally supplied in 30 cc syringe, 6 & 12 oz cartridge or 5 gallon pail

    Property 418 418HTC 519
    Type Non – Silicone Non – Silicone Silicone
    Consistency Soft Paste Soft Paste Soft Paste
    Color White/Gray Gray White
    Density. g / cc 2.7 2.2 2.8
    Thermal Conductivity, W/m°K 2.1 3.2 1.5
    Service Temperature, °C -50 to 200 °C -50 to 200 °C -50 to 200 °C
    Volume Resistivity, Ohm-cm 1012 1012 1012
    Dielectric Strength, Volts/Mil 392 219 500
    Dielectric constant 4.5 4.0 5.0
    TGA Weight Loss, % Wt, (150°C/24 hrs 0.1 0.1 0.1
    Compressibility, @ 5 psi 25% 30% 30%
    Flame Retardancy V-O Equivalent V-O Equivalent V-O Equivalent