Timtronics Gap Fillers and Pads are designed to meet the stringent electronics industry’s ever growing requirement for interface materials for conformability, good thermal management and ease of use. The range of gap fillers and pads have characteristics like, removal air gaps to reduce thermal resistance, high conformability, vibration dampening and easy to apply.
TIM-GAP is designed to meet industry’s growing need for interface material with high conductivity and greater conformability for easier application. Electrically isolating property allows its use in applications requiring isolations between heat sinks and high voltage, bare leaded devices. Available in Silicone and Non Silicone formulas with thermal conductivity up to 11 W/mºK.
Gap Fillers are used to fill air gaps between components or PC boards and heat sinks, metal enclosures and chasses. Ideal for application where large gap tolerances are present due to steps, rough surfaces, and high stack-up. Gap Filler materials allow the designer to be less concerned with components proximity to heat sinks or heat spreaders.
|Thermal ConductivityW/m °k||ASTM D5470 Modified||1.4||2.4||2.8||6.0||11.0||1.3||1.5||1.6|
|Thermal Resistance°Cin2/W (Thickness)||TO-3 method||2.10(0.1″)||1.7(0.1″)||1.1(0.08″)||0.31(0.04″)||0.22(0.06″)||0.90(0.08″)||0.90(0.08″)||0.72(0.02″)|
|Thermal Resistance°Cin2/W (Thickness)||ASTM D257||1014||1014||1012||1012||1011||1010||1013||1015|
|Volume Resistivity||ASTM D2240||48||48||54||54||N/A||48||<5||53|
|Max Service Temperature °C||ASTM D412||200||200||200||200||200||200||200||110|
|Available thickness, mm||0.5 to 5.0||0.5 to 5.0||0.5 to 5.0||0.5 to 5.0||0.5 to 5.0||1.5, 2.0, 2.5||0.5to3.0||2 to 5||0.5,1.0,2.0|
TIM-PAD is a family of thermally conductive and electrically insulating silicone pads. They are clean, production friendly and efficient alternative to mica, ceramics or grease and will provide superb protection against damage due to deformation, shock or vibration. Available with or without adhesive for easy handling and installation.
Interface between a power transistor, CPU or other heat-generating components. Isolate electrical components and power sources from heat sink and/or mounting brackets. Interface for discrete semiconductors requiring low pressure spring clip mounting. Medical devices, military and industrial controls.
|Thermal ConductivityW/m °k||ASTM D5470 Modified||1.1||1.6||3.0||1.6|
|Thermal Resistance°Cin2/W (Thickness)||TO-3 method||0.51 (0.08”)||0.55(0.08”)||0.3(0.08”)||0.35(0.01”)|
|Volume Resistivity||ASTM D257||1015||1015||1015||1015|
|Hardness Shore 00||ASTM D2240||86||93||84||49|
|Elongation %||ASTM D412||<2||<2||<3||N/A|
|Max.Service Temperature °C||200||200||200||150|
|Available thickness, mm||0.15,0.20,0.30||0.15,0.20,0.30||0.20,0.30 0.45,0.85||0.20,0.30 0.45,0.85||0.25|
TIM-LGF are thermally conductive liquid gap filler materials formulated to provide a balance of cured material properties, highlighted by “gel-like” modules and good compression set or memory. This material is available in thermally conductive & electrically insulating or conductive, one part or two part, room or elevated temperature curing system. Form-in-place gap fillers are ideal for applying any thickness with little or no stress.
LED bonding, PCBA to housing, discrete component to heat spreader, Computer and Peripherals and Automotive Electronics.
|Mix Ratio||One PartHeat Cure||One Part RTV||One Part RTV||Two Part 1:1|
|Thermal Conductivity, W/ m °K||2.0||0.63||N/A||2.0|
|Volume Resistivity, Ohm-cm||1012||1015||0.09||1012|
|Cure time @ 25°C||N/A||72 Hrs.||24 Hrs.||2 Hrs|
|Cure time @ 120°C||30 Minutes||N/A||N/A||5 Minutes|
|Pot Life @ 25°C||24 Hrs||8 Minutes||15 Minutes||1 Hr.|
|Hardness, shore 00/(A)||70||40(A)||40(A)||70|
TIM-PUTTY is ‘Ultra Soft” and highly conformable paste- type gap filler. Its “ultra soft” consistency assures efficient heat transfer between delicate parts where minimum pressure can be tolerated. This Form-in-place gap filler is ideal for applying any thickness with little or no stress. It is designed to provide a thermal solution for the recent trends of integrating higher frequency electronics into smaller devices. TIM-PUTTY easily forms and adheres to most surfaces, shapes and sizes of components with very low compression force. Non-Silicone formulas avoid silicone contaminations to delicate devices. It can be easily dispensed from cartridges or pail using pneumatic dispenser.
TIM-PUTTY is used to fill air gaps between components or PC boards and heat sinks, metal enclosures and chasses. Ideal for application where large gap tolerances are present due to steps, rough surfaces, and high stack-up. TIM-Putty materials allow the designer to be less concerned of CTE stresses during thermal cycling.
Availability : Tim-Putty are generally supplied in 30 cc syringe, 6 & 12 oz cartridge or 5 gallon pail
|Type||Non – Silicone||Non – Silicone||Silicone|
|Consistency||Soft Paste||Soft Paste||Soft Paste|
|Density. g / cc||2.7||2.2||2.8|
|Thermal Conductivity, W/m°K||2.1||3.2||1.5|
|Service Temperature, °C||-50 to 200 °C||-50 to 200 °C||-50 to 200 °C|
|Volume Resistivity, Ohm-cm||1012||1012||1012|
|Dielectric Strength, Volts/Mil||392||219||500|
|TGA Weight Loss, % Wt, (150°C/24 hrs||0.1||0.1||0.1|
|Compressibility, @ 5 psi||25%||30%||30%|
|Flame Retardancy||V-O Equivalent||V-O Equivalent||V-O Equivalent|
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